Diseño y simulación de la configuración de aletas para el proceso de disipación de calor mediante software especializado

Abstract

This research is centered on the development, computational modeling, and evaluation of heat sinks with fin arrangements to improve thermal performance in electronic systems. Two heat sink designs made of aluminum 6061-T6 and aluminum 1050 were evaluated, considering the geometric distribution of fins and the material's impact on thermal efficiency. Thermal analyses were performed with ANSYS software, considering a constant heat flux and evaluating both natural and forced convection conditions. The results demonstrated that the design incorporating a central flat area improved thermal coupling and ensured uniform heat distribution, whereas the uniform fin configuration exhibited greater thermal gradients. A comprehensive analysis of thermal resistance and pressure drop was performed for both models, highlighting that an optimal balance between the heat sink’s geometric layout and the material’s thermal properties is crucial to achieving efficient heat dissipation. Comparative assessments underscored that aluminum 6061-T6 delivers superior performance in applications demanding structural integrity, whereas aluminum 1050 presents a cost-effective alternative with excellent thermal conductivity. This study provides valuable guidelines for optimizing heat sink designs in critical electronic applications.